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I NTEGRATED C IRCUITS D IVISION
PLA192
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020 , in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033 .
Device
All Versions
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is ESD Sensitive , and should be handled according to the industry standard JESD-625 .
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
All Versions
Maximum Temperature x Time
250oC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. IXYS Integrated Circuits Division employs the use of silicone coating as an optical
waveguide in the standard PLA192 (without the "E" suffix); the use of a short drying bake could be necessary if a
wash is used after solder reflow processes. The E-suffix product, being of double-molded construction, does not have
the same necessity for a drying bake. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning
methods that employ ultrasonic energy should not be used.
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